creat by art - high efficiency, low vf - high current capability - high reliability - high surge current capability - ul recognized file # e-326243 - halogen-free according to iec 61249-2-21 definition molding compound, ul flammability classification rating 94v-0 base p/n with suffix "g" on packing code - halogen-free terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test v rrm v v rms v v dc v i f(av) a trr ns r jc o c/w t j o c t stg o c document number: ds_d1310026 version: a14 ugf2004g thru UGF2008G taiwan semiconductor isolated ultra fast rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanical data case: ito-220ab polarity: as marked ito-220ab description - ugf200xg series are ideal devices for free wheeling function in switching mode power supply and high frequency dc/dc converters - ugf200xg series: their low stored charge and ultrafast soft recovery minimizes ringing and electrical noise in pow er switching circuits reducing power loss mounting torque: 5 in-lbs maximum weight: 1.7g (approximately) maximum ratings and electrical characteristics (t a =25 unless otherwise noted) parameter symbol ugf 2004g ugf 2005g ugf 2006g ugf 2007g ugf 2008g unit maximum repetitive peak reverse voltage 200 300 400 500 600 maximum rms voltage 140 210 280 350 420 maximum dc blocking voltage 200 300 400 500 600 maximum average forward rectified current 20 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load i fsm 150 a maximum instantaneous forward voltage (note 1) i f = 10 a v f 0.95 1.25 1.70 v maximum reverse current @ rated vr t j =25 t j =125 i r 5 a 100 maximum reverse recovery time (note 2) 20 25 note 1: pulse test with pw=300 sec, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a typical thermal resistance 2 operating junction temperature range - 55 to +175 - 55 to +150 storage temperature range - 55 to +175 - 55 to +150
part no. part no. ugf2004g ugf2004g (ta=25 unless otherwise noted) document number: ds_d1310026 version: a14 green compound description 50 / tube packing ugf2004g thru UGF2008G taiwan semiconductor ordering information packing code green compound code package ugf200xg (note 1) c0 suffix "g" ito-220ab note 1: "xx" defines voltage from 200v (ugf2004g) to 600v (UGF2008G) ugf2004g c0g c0 g ratings and characteristics curves example preferred p/n packing code green compound code ugf2004g c0 c0 0 5 10 15 20 25 0 255075100125150175 average forward a current (a) case temperature ( o c) fig.1 forward current derating curve resistive or inductive load with heatsink ugf2007g-08g ugf2004g-06g 0 20 40 60 80 100 120 140 160 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method 0.001 0.01 0.1 1 10 0 20 40 60 80 100 120 140 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 2 typical reverse characteristics tj = 25 0.1 1 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 instantaneous forward current (a) forward voltage (v) fig. 4 typical forward characteristics tj=25 tj=125 04g 05g-06g 07g-08g
min max min max a 4.30 4.70 0.169 0.185 b 2.50 3.16 0.098 0.124 c 2.30 2.96 0.091 0.117 d 0.46 0.76 0.018 0.030 e 6.30 6.90 0.248 0.272 f 9.60 10.30 0.378 0.406 g 3.00 3.40 0.118 0.134 h 0.95 1.45 0.037 0.057 i 0.50 0.90 0.020 0.035 j 2.40 3.20 0.094 0.126 k 14.80 15.50 0.583 0.610 l - 4.10 - 0.161 m 12.60 13.80 0.496 0.543 n - 1.80 - 0.071 o 2.41 2.67 0.095 0.105 p/n = specific device code g = green compound yww = date code f = factory code document number: ds_d1310026 version: a14 marking diagram ugf2004g thru UGF2008G taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) 10 100 1000 0.1 1 10 100 capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1310026 version: a14 ugf2004g thru UGF2008G taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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